PACK EXPO International 2018

14. October 2018 - 17. October 2018

Meet us at PACK EXPO in Chicago, IL

Get informed about our services in Industrial Communication, Hard & Software Development, and Functional Safety. We are also the ones to speak to when it comes to Motion Control, or Sensors.

 

Here´s how we can support you:

  • as an extension of your in-house engineering development team
  • when you need to get something done more quickly than can be done internally
  • if you are looking for more bandwidth to complete a project
  • if you´d like to expand your in-house expertise in some of the areas in which MESCO excels, like e.g. Functional Safety, Motion Safety, IO-Link Products/Services, Ethernet fieldbuses, Foundation Fieldbus, HART, PROFIBUS, and OPC

 

We look forward to meeting you.

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News

07/31/2018

The introduction to functional safety

The demand for functionally safe products is growing continuously. Standards such as IEC 61508, IEC 62061, IEC 61511 and ISO 13849 or EN 61800-5-2 are particularly challenging for beginners. MESCO provides a practical introduction to the topic of functional safety.

07/18/2018

Success Story: Sensor Positioner for On/Off Valves for Actuator

For Kaneko Sangyo Co. Ltd., Silent Technology, MESCO developed successfully an electronics that controls on/off valves. Additionally, it enables diagnoses in the on-going process and provides the electronic position feedback.

05/16/2018

Technical Paper: 3D Models / 3D Printing in the Hardware Development

The use of industrial 3D printing offers the possibility of creating complex, functional geometries to support fast and agile hardware development. In addition, 3D printing makes the production of small batch sizes at economical unit costs.